Description

 Detailed parameters of ceramic heat sink:

1. Material: 96% aluminum oxide (AL 2O3) white

2. Thermal conductivity: 27.3w/m.k

3. The insulation is below 22.5kv and the temperature resistance is up to 1600 degrees

4. Density: 3.6G/CM3

5. Coefficient of thermal expansion: 0.000003

6, the ceramic itself does not store heat, direct heat dissipation, fast speed

7. Ceramics are originally of polycrystalline structure to enhance the heat dissipation speed.Compared to the conditions, beyond the market for most thermal insulation materials

8. Ceramics have multi-direction heat dissipation, further accelerating the heat dissipation speed

9. Ceramic insulation, high temperature resistance, oxidation resistance, acid and alkali resistance, long service life

10. Effective anti-interference (EMI) and anti-static

11. Natural inorganic materials meet the requirements of environmental protection

12. Small size, light weight, high strength and space saving.

13, the alumina ceramic plate is suitable for IC, MOS, transistor, schottky, IGBT, etc., need to heat the surface heat source!

14. It is especially suitable for high-power equipment. The design space is light, thin, short and small

If you need other sizes, Please feel free to contact me.

'