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AMAOE MI11 BGA reballing Solder template schablone für Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254

USD 4.88

AMAOE MI11 BGA reballing Solder template schablone für Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254

Description
Specification
SN74HC86N 74HC86 DIP-14
USD 0.05USD 0.06
100% neue MT6577 BGA Chipset
USD 3.12USD 3.18
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