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Interposer-platine, Doppel-gestapelt Motherboard Mid Rahmen Reballing Mittleren Schicht Separaten Bord MC_E METROCIRC für iPhone X XS /MAX 11PRO

USD 4.72USD 6.30

Interposer-platine, Doppel-gestapelt Motherboard Mid Rahmen Reballing Mittleren Schicht Separaten Bord MC_E METROCIRC für iPhone X XS /MAX 11PRO

Description
Specification
TLP701
USD 8.74USD 9.20
5PCS TLP701 SOP6
USD 0.96
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