Wylie WL-71 BGA Reballing Schablone Für Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM power WiFi IC Chip
Wylie WL-71 BGA Reballing Schablone Für Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM power WiFi IC Chip
Modellnummer : For Xiaomi CC9/CC9e/8SE/A3/Redmi Note8 SDM665 SM6125/SDM710 BGA254
Bescheinigung : NONE
Markenname : LANRUISI
Kompatible Marke : XIAOMI
Ursprung : CN (Herkunft)
Kompatible Marke : XIAOMI