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Wylie WL-71 BGA Reballing Schablone Für Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM power WiFi IC Chip

USD 2.74USD 2.80

Wylie WL-71 BGA Reballing Schablone Für Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM power WiFi IC Chip

Description

Wylie WL-71 BGA Reballing Schablone Für Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM power WiFi IC Chip

Specification

Modellnummer : For Xiaomi CC9/CC9e/8SE/A3/Redmi Note8 SDM665 SM6125/SDM710 BGA254

Bescheinigung : NONE

Markenname : LANRUISI

Kompatible Marke : XIAOMI

Ursprung : CN (Herkunft)

Kompatible Marke : XIAOMI

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