Wylie WL-78 BGA Reballing Schablone für Xiaomi Redmi 9/Hinweis 9 4G/Note9 Pro Qualcomm 662 SM6115/750G SM7225 MT6769v CPU RAM IC Chip
USD 2.66USD 2.80
Wylie WL-78 BGA Reballing Schablone für Xiaomi Redmi 9/Hinweis 9 4G/Note9 Pro Qualcomm 662 SM6115/750G SM7225 MT6769v CPU RAM IC Chip